Patent “V” Shaped Array
Funnel shaped aluminum fins and a series of perforated dimples guide the airflow towards the heatpipes. Specially designed X-Vents, that act similar to tiny airplane wings and prevent deadspots behind and between heatpipes. The combination of both of these patent technologies results in notably higher airflow over the heatpipes and the adjacent fin area, which ultimately reduces CPU temperatures.
The specially designed X-Vents act similar to tiny airplane wings and prevent deadspots behind and between heatpipes. The combination of these patented technologies results in a notably higher airflow over the heatpipes and the adjacent fin area, ultimately reducing CPU temperatures.
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